MEMS COMPONENT WITH UPSIDE-DOWN CHIP
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United States of America
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Issued Date -
Nov 28, 2024
app pub date -
May 16, 2024
filing date -
May 16, 2024
priority date (Note) -
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Abstract
A device is provided that includes a MEMS chip and a housing forming an enclosure around the MEMS chip. The enclosure has a top and a bottom, the housing includes an upper unit, a lower unit and sidewalls which extend between the upper unit and the lower unit, the upper unit delimits the top of the enclosure, and the lower unit delimits the bottom of the enclosure, the lower unit or the sidewalls of the housing form an external bottom surface of the housing, the external bottom surface lies on a contacting side of the MEMS component, the housing further includes a ceramic package structure. The device includes the MEMS component and electrical connections that extend from the MEMS chip through the ceramic package structure to the contacting side of the MEMS component. The MEMS chip is mounted to the top of the enclosure.
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