SOLDER-FREE JOINT AND WELDING METHOD THEREOF
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United States of America
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Issued Date -
Nov 28, 2024
app pub date -
Mar 23, 2022
filing date -
Mar 23, 2022
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Abstract
A solder-free joint and a welding method thereof are provided. The welding method includes the following steps: S1: uniformly coating a flux on a surface of each of a plurality of materials to be soldered, thereby forming a flux layer; S2: performing binding according to the surface of the material, the flux layer, and the surface of the material; and S3: putting the materials into a hot-pressing device, and setting a desired pressure and temperature for soldering. In pretreatment before soldering, the welding method does not add any solder. The obtained solder-free joint has a desirable conductivity and desirable mechanical properties.
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