LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS
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United States of America
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Issued Date -
Nov 21, 2024
app pub date -
May 18, 2023
filing date -
May 18, 2023
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Abstract
Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate with a first surface and a second surface opposite from the first surface. In an embodiment, pads are on the first surface of the package substrate, where the pads have a first width. In an embodiment, a layer is on the first surface of the package substrate, where the layer comprises wells through the layer, and where the wells have a second width that is wider than the first width. In an embodiment, a liquid metal is in the wells and in contact with the pads.
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