Extended Seal Ring Structure on Wafer-Stacking
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United States of America
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Issued Date -
Nov 21, 2024
app pub date -
Jul 29, 2024
filing date -
Jul 29, 2024
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Abstract
Embodiments include a wafer-on-wafer bonding where each wafer includes a seal ring structure around die areas defined in the wafer. Embodiments provide a further seal ring spanning the interface between the wafers. Embodiments may extend the existing seal rings of the wafers, provide an extended seal ring structure separate from the existing seal rings of the wafers, or combinations thereof.
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