SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
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United States of America
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Issued Date -
Nov 21, 2024
app pub date -
Jul 28, 2024
filing date -
Jul 28, 2024
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Abstract
Semiconductor packages and methods of forming the same are disclosed. An semiconductor package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.
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