FINFET DEVICES AND METHODS OF FORMING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240387287A1
SERIAL NO

18788153

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Abstract

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Provided are FinFET devices and methods of forming the same. A FinFET device includes a substrate, a first gate strip and a second gate strip. The substrate has at least one first fin in a first region, at least one second fin in a second region and an isolation layer covering lower portions of the first and second fins. The first fin includes a first material layer and a second material layer over the first material layer, and the interface between the first material layer and the second material layer is uneven. The first gate strip is disposed across the first fin. The second gate strip is disposed across the second fin.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ching, Kuo-Cheng Hsinchu County, TW 374 8264
Huang, Jui-Chien Hsinchu City, TW 54 103
Lin, Chun-Hsiung Hsinchu County, TW 118 1300
Wang, Chih-Hao Hsinchu County, TW 1232 8869
Wang, Pei-Hsun Kaohsiung City, TW 50 141

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