ELECTROSTATIC CHUCKS AND RELATED METHODS
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United States of America
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Nov 21, 2024
app pub date -
May 1, 2024
filing date -
May 1, 2024
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Abstract
A device may include an additive manufactured monolithic structure including an insulating body and at least one conductive region located in the insulating body. The additive manufactured monolithic structure does not include a bonding component between the insulating body and the at least one conductive element. The additive manufactured monolithic structure may further include at least one conduit that is free from any material. The insulating body may include a ceramic material and the at least one conductive region may include a metal material, such that the ceramic material and the metal material are co-deposited layer by layer to form the additive manufactured monolithic structure.
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