SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
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United States of America
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Issued Date -
Nov 21, 2024
app pub date -
May 19, 2023
filing date -
May 19, 2023
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Abstract
A method of manufacturing a semiconductor device includes reducing a thickness of a device wafer bonded to a carrier wafer, wherein the device wafer includes a device, a portion of the carrier wafer beyond the device, in a plan view, is called a non-bonding area, and a portion of the carrier wafer overlapping the device, in the plan view, is called a device area. The method further includes performing an etching process on the non-bonding area of the carrier wafer, wherein the etching process is performed completely outside the device area of the carrier wafer.
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