STACKED SUBSTRATE FOR LASER LIFT-OFF, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING APPARATUS
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United States of America
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Nov 21, 2024
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Aug 19, 2022
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Aug 19, 2022
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A stacked substrate for laser lift-off includes a first substrate that transmits a laser beam, a first insulating layer that absorbs the laser beam, a first polysilicon layer that transmits the laser beam, a second insulating layer that absorbs the laser beam, a second polysilicon layer that transmits the laser beam, and a first device layer in an order. The stacked substrate includes a first electrode penetrating the first insulating layer to electrically connect the first substrate and the first polysilicon layer, and a second electrode penetrating the second insulating layer to electrically connect the first polysilicon layer and the second polysilicon layer. The first electrode and the second electrode contain a material that transmits the laser beam, and are positioned apart from each other without being overlapped when viewed from a top.
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