ETCH APPARATUS FOR COMPENSATING SHIFTED OVERLAYERS
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United States of America
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Issued Date -
Nov 21, 2024
app pub date -
Jul 29, 2024
filing date -
Jul 29, 2024
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Abstract
The current disclosure includes a plasma etching system that includes a movable plasma source and a moveable wafer stage. A relative position between the movable plasma source and the movable wafer stage can be varied to set up an angle along which plasma particles of the plasma hits a wafer positioned on the wafer stage.
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