SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
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United States of America
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Issued Date -
Nov 21, 2024
app pub date -
May 15, 2024
filing date -
May 15, 2024
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Abstract
Disclosed are an apparatus and a method for treating a substrate, and more particularly, an apparatus and a method for heat treating a substrate. The apparatus includes: a heating unit provided in the inner space, and providing a treatment space in which a heating process of the substrate is performed; a transfer plate positioned within the inner space, and movable between an inner position for loading the substrate into the treatment space or for unloading the substrate from the treatment space and an outer position provided outside the heating unit; and a gas injection unit positioned within the inner space, and for injecting atmosphere gas toward the substrate at the outer position.
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