EUV PHOTO MASKS AND MANUFACTURING METHOD THEREOF

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240385506A1
SERIAL NO

18787278

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Abstract

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In a method of manufacturing a reflective mask, a photo resist layer is formed over a mask blank. The mask blank includes a substrate, a reflective multilayer on the substrate, a capping layer on the reflective multilayer, an absorber layer on the capping layer and a hard mask layer, and the absorber layer is made of Cr, CrO or CrON. The photo resist layer is patterned, the hard mask layer is patterned by using the patterned photo resist layer, the absorber layer is patterned by using the patterned hard mask layer, and an additional element is introduced into the patterned absorber layer to form a converted absorber layer.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Chia-Jen Jhudong Township, TW 98 1413
HSU, Pei-Cheng Taipei, TW 111 530
LEE, Hsin-Chang Zhubei City, TW 203 1090
LIEN, Ta-Cheng Cyonglin Township, TW 104 198

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