PACKAGE AND METHOD OF FORMING SAME
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United States of America
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Issued Date -
Nov 21, 2024
app pub date -
Jul 29, 2024
filing date -
Jul 29, 2024
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Abstract
An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.
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