MICROELECTROMECHANICAL DEVICE AND METHOD FOR MAKING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240383743A1
SERIAL NO

18318698

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Abstract

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A microdevice including a first pedestal, a second pedestal parallel to the first pedestal, the second pedestal comprising a first protrusion on its top surface. The device also including a conformal dielectric layer and a metal structure formed over a portion of the conformal dielectric layer. The metal structure including a first portion surrounding the first protrusion, a second portion parallel to the top surface of the polysilicon pedestal, and a third portion connecting the first portion and the second portion.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HUNG, TSAI-HAO Hsinchu City, TW 43 71
LIAO, Shih-Yu Hsinchu City, TW 19 3

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