PROCESSING TOOL
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Nov 21, 2024
app pub date -
May 2, 2024
filing date -
May 2, 2024
priority date (Note) -
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Abstract
A processing tool for removing a chamfer of a wafer that is formed on its front surface with a central region and a peripheral surplus region, the chamfer being formed in the peripheral surplus region. The processing tool includes an annular grinding grindstone with an opening into which a spindle is inserted and having first and second side surfaces and a polishing grindstone formed on at least one of the first side surface or the second side surface. The processing tool is formed in such a manner as to satisfy both the following conditions (1) and (2):
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