METHOD OF PROCESSING SUBSTRATE AND APPARATUS FOR PROCESSING SUBSTRATE
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United States of America
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Issued Date -
Nov 21, 2024
app pub date -
Mar 7, 2024
filing date -
Mar 7, 2024
priority date (Note) -
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Abstract
One object is to suppress the surface of a substrate from being scratched in the course of a polishing process. There is provided a method of processing a substrate, comprising: a process of forming a protective film on an outer peripheral part of the substrate including a bevel portion, prior to a process of polishing the substrate, wherein the process of forming the protective film includes applying a protective film material in a liquid form onto the outer peripheral part of the substrate and curing the applied protective film material; and the process of polishing the substrate with the protective film formed on the outer peripheral part thereof.
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