POST CMP BRUSH AND METHOD OF MANUFACTURING
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United States of America
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Issued Date -
Nov 21, 2024
app pub date -
Oct 19, 2022
filing date -
Oct 19, 2022
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Abstract
A brush for post chemical/mechanical polishing cleaning of a semiconductor wafer is provided, the brush comprising a microporous core with open cell pores and an outer layer of a plurality of loop fibers formed on the outer surface of the microporous core, wherein the brush has a first core flow resistance R1, a second through surface flow resistance R2, and a third flow resistance R3 across the surface and wherein R3
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