Importance

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Abstract

An example semiconductor package includes a structure, a first semiconductor chip disposed on an upper surface of the structure and electrically connected to the structure, a dummy semiconductor chip disposed on and contacting the upper surface of the structure, a molding layer surrounding a sidewall of the first semiconductor chip and a sidewall of the dummy semiconductor chip on the upper surface of the structure, a redistribution layer disposed on an upper surface of the first semiconductor chip, an upper surface of the dummy semiconductor chip, and an upper surface of the molding layer, a first through-via extending through the molding layer in a vertical direction and electrically connecting the structure and the redistribution layer, a second through-via extending through the dummy semiconductor chip in the vertical direction and electrically connecting the structure and the redistribution layer, and a capacitor disposed inside the dummy semiconductor chip.

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First Claim