PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM AND ELECTRONIC APPARATUS
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United States of America
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Issued Date -
Nov 14, 2024
app pub date -
Aug 24, 2023
filing date -
Aug 24, 2023
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Abstract
Examples of the present disclosure disclose a package structure and a fabrication method thereof, a memory system and an electronic apparatus. The package structure includes: a substrate; a first stack structure located on the substrate and including: at least one first chip; a molding layer located on the substrate and encapsulating the first stack structure; and first support structure penetrating the molding layer and located on the periphery of the first stack structure. The first support structure has a height greater than that of the first stack structure.
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