SELECTIVE DEPOSITION OF A MATERIAL COMPRISING SILICON AND NITROGEN

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United States of America

APP PUB NO 20240379347A1
SERIAL NO

18656799

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Abstract

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The present disclosure relates to methods and systems for selectively depositing a material comprising silicon and nitrogen onto a substrate comprising a first surface and a second surface, wherein the deposition occurs on the first surface of the substrate more so than on the second surface of the substrate. More specifically, the methods and systems comprise exposing a substrate that comprises a first surface and a second surface to a source of chlorine and a source of silicon, then exposing the substrate to a source of nitrogen to selectively deposit a material comprising silicon and nitrogen on the first surface of the substrate.

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Patent Owner(s)

Patent OwnerAddress
ASM IP HOLDING B VVERSTERKERSTRAAT 8 ALMERE 1322AP

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pore, Viljami J Helsinki, FI 66 9755
Ruoho, Mikko Vantaa, FI 3 1
Tois, Eva E Espoo, FI 40 2593
Tuominen, Marko Helsinki, FI 102 10592

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