MULTIPLE-MASK MULTIPLE-EXPOSURE LITHOGRAPHY AND MASKS
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United States of America
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Nov 14, 2024
app pub date -
Jul 22, 2024
filing date -
Jul 22, 2024
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Abstract
Examples of a multiple-mask multiple-exposure lithographic technique and suitable masks are provided herein. In some examples, a photomask includes a die area and a stitching region disposed adjacent to the die area and along a boundary of the photomask. The stitching region includes a mask feature for forming an integrated circuit feature and an alignment mark for in-chip overlay measurement.
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