MEMS PROBE MODULE STRUCTURE
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United States of America
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Nov 14, 2024
app pub date -
May 12, 2023
filing date -
May 12, 2023
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Abstract
A micro-electromechanical system (MEMS) probe module structure is provided, including: a ceramic carrier and a plurality of probes fixed on the ceramic carrier; the ceramic carrier has a top surface, a side surface, and a bottom surface, and a window in the center; the ceramic carrier is provided with a plurality of lead wires, each lead wires are distributed on the top surface, the side surface and the bottom surface and connected together; the bottom surface is provided with a plurality of bonding areas, and each lead wire is connected to a corresponding bonding area; each of the probes includes a needle tip and the needle arm, the needle tup is arranged at one end of the needle arm, and the needle arm is welded to the bonding area, so that the needle arm extends below the window like a cantilever and the needle tip faces downward.
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