WAFER RECEIVER, ELECTROCHEMICAL POROSIFICATION APPARATUS AND METHOD USING SAME
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United States of America
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Issued Date -
Nov 14, 2024
app pub date -
Sep 27, 2022
filing date -
Sep 27, 2022
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Abstract
There is described a wafer receiver for use in an electrochemical porosification process. The wafer receiver generally has an electrode body having a first flat surface, a second flat surface opposite the first flat surface, a groove recessed from the first flat surface and running within a central region of the electrode body, a seat extending annularly around the central region of the electrode body and recessed from the first flat surface, a conduit in fluid communication with the groove and connectable to a vacuum pump; and an annular sealing element received in the seat, the annular sealing element being made of a resilient material resistant to said electrochemical porosification process, the annular sealing element having a wafer receiving surface protruding from the first flat surface when received in the scat.
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