STOPPER BUMP STRUCTURES FOR MEMS DEVICE
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United States of America
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Issued Date -
Nov 14, 2024
app pub date -
Jul 25, 2024
filing date -
Jul 25, 2024
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Abstract
Various embodiments of the present disclosure are directed towards an integrated chip (IC) including a substrate. A plurality of adhesive structures is disposed on the substrate. A microelectromechanical systems (MEMS) structure is disposed on the adhesive structures. The MEMS structure comprises a movable element disposed within a cavity. A first plurality of stopper bumps is disposed between the movable element and the substrate.
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