PRINTING HEAD SUBSTRATE
Number of patents in Portfolio can not be more than 2000
United States of America
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N/A
Issued Date -
Nov 14, 2024
app pub date -
Apr 10, 2024
filing date -
Apr 10, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A printing head substrate includes: a heating element configured to control a temperature of the printing head substrate that ejects liquid supplied from a liquid supply port from an ejection orifice; and a driver configured to drive the heating element. An electrical connection between the heating clement and the driver is made by plural pieces of wiring.
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