PHOTOSENSITIVE RESIN PRINTING PLATE PRECURSOR FOR RELIEF PRINTING, AND PRINTING PLATE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240375396A1
SERIAL NO

18690984

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A photosensitive resin printing plate precursor is disclosed for relief printing, including a support, a photosensitive resin layer, and a cover film stacked in this order, wherein the photosensitive resin layer comprises a lower layer present on a support side and an upper layer present on a cover-film side, wherein the upper layer is a photosensitive resin layer that contains a water-soluble or water-dispersible resin (A) having a glass transition temperature measured by differential scanning calorimeter of 40 to 90° C., wherein the upper layer has a thickness of 3 to 30 micrometers, wherein the lower layer is a layer that contains a water-soluble or water-dispersible resin (B) having a glass transition temperature higher than the glass transition temperature of the water-soluble or water-dispersible resin (A) by 5° C. or more, and wherein the glass transition temperature of the resin (B) measured by differential scanning calorimeter is 95 to 135° C.

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Patent Owner(s)

Patent OwnerAddress
TOYOBO MC CORPORATIONOSAKA UMEDA TWIN TOWERS SOUTH 13-1 UMEDA 1-CHOME KITA-KU OSAKA-SHI OSAKA 5300001

International Classification(s)

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  • 2022 Application Filing Year
  • B41C Class
  • 31 Applications Filed
  • 9 Patents Issued To-Date
  • 29.04 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwashita, Yuji Otsu-shi, Shiga, JP 9 1793
Tanigawa, Masahito Okayama-shi, Okayama, JP 8 26

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  • B41C Class
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges40101 - 1002.557.51012.51517.52022.52527.53032.53537.54042.5

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