WIRING SUBSTRATE AND ELECTRONIC DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Nov 7, 2024
app pub date -
Jul 22, 2022
filing date -
Jul 22, 2022
priority date (Note) -
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Abstract
Provided is a wiring substrate, including: a base substrate; a plurality of constant voltage signal lines and a plurality of first connection lines; a plurality of first pad regions. Each of the first pad regions includes a plurality of sub-regions. Each of the sub-regions includes a plurality of pad groups. The plurality of pad groups include at least a first pad group and a last pad group. An orthographic projection of one of the first pad group and the last pad group on the base substrate is partially overlapped with an orthographic projection of one of the constant voltage signal lines on the base substrate. An orthographic projection of the other of the first pad group and the last pad group on the base substrate is partially overlapped with an orthographic projection of one of the first connection lines on the base substrate.
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