HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
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United States of America
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Issued Date -
Nov 7, 2024
app pub date -
Jul 16, 2024
filing date -
Jul 16, 2024
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Abstract
A high-frequency module includes an antenna terminal and an input terminal. A second switch is connected between the antenna terminal and the input terminal, and a power amplifier is connected between the second switch and the input terminal. A mounting substrate has a first main surface and a second main surface on opposite sides of the mounting surface. The power amplifier includes a driver stage amplifier and an output stage amplifier. The driver stage amplifier and the second switch are arranged on the second main surface of the mounting substrate, and the output stage amplifier is arranged on the first main surface of the mounting substrate. The driver stage amplifier and the second switch are included in one semiconductor chip.
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