COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS
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United States of America
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Issued Date -
Nov 7, 2024
app pub date -
Jul 12, 2024
filing date -
Jul 12, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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