WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, BACKBOARD AND DISPLAY APPARATUS
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United States of America
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Issued Date -
Nov 7, 2024
app pub date -
May 31, 2022
filing date -
May 31, 2022
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Abstract
A wiring substrate includes a substrate, at least one conductive layer(s) located on a side of the substrate, and a protective layer located on a side of the at least one conductive layer. A conductive layer includes a plurality of pad groups, and a pad group includes a plurality of conductive pads. The protective layer includes a plurality of openings; a portion of the conductive layer exposed by an opening is a conductive pad. A maximum dimension of the conductive pad in a direction parallel to the substrate is greater than or equal to 1.5 times a minimum distance between an edge of the conductive pad and an edge of the conductive layer, and less than or equal to 30 times the minimum distance between the edge of the conductive pad and the edge of the conductive layer.
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