TECHNIQUES FOR PROCESSING DEVICES
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United States of America
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Issued Date -
Nov 7, 2024
app pub date -
Dec 15, 2023
filing date -
Dec 15, 2023
priority date (Note) -
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Abstract
Representative techniques provide process steps for forming a microelectronic assembly, including preparing microelectronic components such as dies, wafers, substrates, and the like, for bonding. One or more surfaces of the microelectronic components are formed and prepared as bonding surfaces. The microelectronic components are stacked and bonded without adhesive at the prepared bonding surfaces.
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