RADIANT SUBSTRATE HEATING FOR THERMOCOMPRESSIVE BONDING AND APPARATUS FOR IMPLEMENTING THE SAME
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United States of America
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Issued Date -
Nov 7, 2024
app pub date -
May 5, 2023
filing date -
May 5, 2023
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Abstract
A bonded assembly may be formed by: disposing a packaging substrate having substrate-side bonding structures over a transparent plate; heating the packaging substrate using radiative heating in which a radiative heating source provides radiation to a bottom surface of the packaging substrate through the transparent plate; attaching a semiconductor die having die-side bonding structures to a bottom of a thermocompressive bonding head; bringing the semiconductor die and the packaging substrate to indirect contact with each other with an array of solder material portions therebetween; and bonding the semiconductor die to the packaging substrate by reflowing and solidifying the solder material portions.
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