PACKAGE STRUCTURE
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United States of America
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N/A
Issued Date -
Nov 7, 2024
app pub date -
Jul 18, 2024
filing date -
Jul 18, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A package structure includes an insulating encapsulation, a semiconductor die, and a redistribution circuit structure. The semiconductor die is encapsulated in the insulating encapsulation. The redistribution circuit structure includes conductive patterns, wherein the conductive patterns each comprise a first portion, at least one second portion, and at least one connecting portion. A first edge of the at least one connecting portion is connected to the first portion, and a second edge of the at least one connecting portion is connected to the at least one second portion, wherein the first edge is opposite to the second edge, and a length of the first edge is greater than a length of the second edge.
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