SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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United States of America
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Issued Date -
Nov 7, 2024
app pub date -
Jul 15, 2024
filing date -
Jul 15, 2024
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Abstract
A semiconductor package includes an inductor, a first die, and a second die bonded to the first die. The inductor includes first inductor patterns, second inductor patterns, and third inductor patterns, and the first inductor patterns and the second inductor patterns are made of different materials. The first inductor patterns and the second inductor patterns are embedded in the first die, and the second inductor patterns are embedded in the second die.
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