CHIP PACKAGE STRUCTURE AND FABRICATION
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United States of America
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Issued Date -
Nov 7, 2024
app pub date -
Aug 2, 2023
filing date -
Aug 2, 2023
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Abstract
The present application provides a chip package structure and a fabrication method thereof, a memory and a memory system. The chip package structure includes a substrate, a chip on a side of the substrate, an energy storage material layer on a side of the chip opposite the substrate, and a package layer that includes a first portion covering the chip and a second portion covering the energy storage material layer. According to the present application, by disposing the energy storage material layer on a side of the chip, the energy storage material layer absorbs the heat generated by the chip, thereby improving the heat dissipation capability of the chip package structure for the chip.
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