Semiconductor Device with Cut Metal Gate and Method of Manufacture

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240371704A1
SERIAL NO

18774643

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Abstract

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An anchored cut-metal gate (CMG) plug, a semiconductor device including the anchored CMG plug and methods of forming the semiconductor device are disclosed herein. The method includes performing a series of etching processes to form a trench through a metal gate electrode, through an isolation region, and into a semiconductor substrate. The trench cuts-through and separates the metal gate electrode into a first metal gate and a second metal gate and forms a recess in the semiconductor substrate. Once the trench has been formed, a dielectric plug material is deposited into the trench to form a CMG plug that is anchored within the recess of the semiconductor substrate and separates the first and second metal gates. As such, the anchored CMG plug provides high levels of resistance to reduce leakage current within the semiconductor device during operation and allowing for improved V-trigger performance of the semiconductor device.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MFG CO LTDNO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Ryan Chia-Jen Hsinchu, TW 173 1719
Chen, Yi-Chun Hsinchu, TW 167 976
Ku, Shu-Yuan Hsinchu, TW 107 321
Tsai, Ya-Yi Hsinchu, TW 52 90
Yang, I-Wei Yilan, TW 30 85

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