CHUCK APPARATUS
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United States of America
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Issued Date -
Nov 7, 2024
app pub date -
Jul 17, 2024
filing date -
Jul 17, 2024
priority date (Note) -
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Abstract
A chuck apparatus is configured to hold a wafer during planarization of the wafer with the aid of anodizing. The chuck apparatus includes a chuck cover, a suction portion, and an energizing portion. The suction portion includes a suction surface that suctions the wafer. The energizing portion is provided in the suction portion so as to come into contact and energize the wafer suctioned by the suction portion. The chuck cover covers the suction portion and the energizing portion in an insulating manner while exposing the suction surface.
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