Importance

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Abstract

A carrier substrate for semiconductor structures which can be transferred by transfer printing, and manufacture of the semiconductor structures on the carrier substrate. The number of the required process steps and thus the required effort is to be generally reduced in the manufacture of component structures on a carrier substrate for providing the component structures in a state in which they can be transferred to a further substrate by transfer printing. For this purpose, it is suggested to produce semiconductor structures to be transferred on a carrier substrate. The method comprises providing a carrier substrate (10) including a semiconductor material with a selected crystal orientation. An active region (11) is produced which has an exposed semiconductor surface (11) and is almost completely delimited by dielectric regions (30, 80) including an isolating dielectric material. Forming a semiconductor structure (40) to be transferred by depositing at least one semiconductor layer on the active region (11) is provided. Removal of at least a part or portion of the dielectric material is performed as well as an etching and removal of semiconductor material beneath the semiconductor structure (40).

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First Claim