TEMPORARY CARRYING SUBSTRATE, CHIP TRANSFERRING DEVICE AND CHIP TRANSFERRING METHOD
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United States of America
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Issued Date -
Nov 7, 2024
app pub date -
Mar 27, 2024
filing date -
Mar 27, 2024
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Abstract
A temporary carrying substrate, a chip-transferring device and a chip transferring method are provided. The chip-transferring device includes a signal control module, a chip-carrying module and a chip-transferring module. The chip-transferring module is allowed to be configured to carry a temporary carrying substrate through the signal control module, and the temporary carrying substrate includes a plurality of micro heaters disposed thereinside or thereoutside. When the chip-transferring module needs to be configured to carry the temporary carrying substrate, a plurality of chips are arranged on a plurality of chip placement areas of the temporary carrying substrate and arranged in a predetermined arrangement shape. When the micro heater needs to be used, the micro heater is allowed to be configured to heat the temporary carrying substrate through the signal control module, thereby causing the temporary carrying substrate to generate thermal expansion to facilitate moving a corresponding one of the chips.
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