USING CUMULATIVE HEAT AMOUNT DATA TO QUALIFY HOT PLATE USED FOR POST-EXPOSURE BAKING
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United States of America
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Nov 7, 2024
app pub date -
Jul 12, 2024
filing date -
Jul 12, 2024
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Abstract
A test wafer is placed inside a baking module and is baked. Via one or more temperature sensors, a cumulative heat amount delivered to the test wafer during the baking is measured. The measured cumulative heat amount is compared with a predefined cumulative heat amount threshold. In response to the comparing indicating that the measured cumulative heat amount is within the predefined cumulative heat amount threshold, it is determined that the baking module is qualified for actual semiconductor fabrication. In response to the comparing indicating that the measured cumulative heat amount is outside of the predefined cumulative heat amount threshold, it is determined that the baking module is not qualified for actual semiconductor fabrication.
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