PROBE CARD DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240369599A1
SERIAL NO

18650536

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A probe card device comprises a testing circuit board, at least one probe and an image capture module. The testing circuit board has a first surface and a second surface in opposite. The at least one probe is disposed on the first surface of the testing circuit board and electrically connected to the testing circuit board. The at least one probe has a probe head and the probe head has a first height to the first surface. The image capture module is disposed on the first surface of the testing circuit board, and is located adjacent to the probe. The image capture module has a head portion and the head portion has a second height to the first surface. Wherein, the second height is smaller than the first height, and the image capture module is aligned to the probe head to capture a visible light image from the probe head.

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Patent Owner(s)

Patent OwnerAddress
SILICON FUTURE MANUFACTURING COMPANY LTDNO 165 NIUPU S RD PUQIAN VIL XIANGSHAN DIST HSINCHU CITY 30091

International Classification(s)

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  • 2024 Application Filing Year
  • G01R Class
  • 2121 Applications Filed
  • 109 Patents Issued To-Date
  • 5.14 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHANG, HENG-RUI Hsinchu City, TW 2 0
LEE, TIEN-CHIA Hsinchu City, TW 3 0
LIAO, MING-CHANG Hsinchu City, TW 1 0
LIN, YOU-CHEN Hsinchu City, TW 5 0
SUNG, WEN-TSUNG Hsinchu City, TW 3 0

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges528724401 - 10025050075010001250150017502000225025002750300032503500375040004250450047505000525055005750

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