PACKAGING DESIGN FOR A FLOW SENSOR AND METHODS OF MANUFACTURING THEREOF
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United States of America
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Nov 7, 2024
app pub date -
Jul 15, 2024
filing date -
Jul 15, 2024
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Abstract
A sensor assembly includes a substrate including an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further including electrical contact pads on at least the inner region. The sensor assembly further includes a housing coupled to the substrate at the outer region to provide a hermetic seal. The sensor assembly further includes a sensor device coupled to the substrate, via the electrical contact pads, at the inner region.
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