CURABLE RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, OPTICAL COMPONENT, AND COMPOSITE MEMBER
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United States of America
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Issued Date -
Nov 7, 2024
app pub date -
Aug 8, 2022
filing date -
Aug 8, 2022
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Abstract
A curable resin composition according to the present invention makes it possible to form a cured product having heat resistance suited for use in applications such as electronic components including printed circuit boards, semiconductor elements and light emitting diodes (LEDs), and automotive electronic components, the curable resin composition containing: a silicon compound (A) that is formed from either one or both of the silsesquioxane groups represented by formula (1) or (2) and from at least one structural unit among the siloxane groups represented by formulas (3)-(5), and that has a weight average molecular weight of 3,000-1,000,000; and a compound (B) that contains at least one element among Ce, La, Pr, Nd, Y and Fe.
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