An Ink Composition for OLED Packaging and An Application thereof
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United States of America
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Nov 7, 2024
app pub date -
Jul 1, 2022
filing date -
Jul 1, 2022
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Abstract
Provided are a Polyhedral Oligomeric Silsesquioxane (POSS) structure-containing ink composition and an application thereof. The ink composition includes, by weight percentage, 20-40% of a POSS structure-containing monomer, 50-70% of a photocuring monomer, and 1-10% of a photoinitiator; and the POSS structure-containing monomer includes a repeating unit as shown in a general formula (R—SiO1.5)n, where at least one R group is selected from a structure having acryloyloxy or methacryloyloxy. By introducing the POSS structure into the ink composition for Organic Light-Emitting Diode (OLED) packaging, the ink composition has a better packaging effect, and an organic packaging layer prepared by the ink has a good and extremely-low Water Vapor Transmission Rate (WVTR) and Oxygen Transmission Rate (OTR), such that the service life of an OLED device can be effectively prolonged. In addition, the ink composition can effectively reduce the preparation cost and process difficulty of an OLED packaging thin film.
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