CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS DEVICE
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United States of America
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Nov 7, 2024
app pub date -
Jul 19, 2024
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Jul 19, 2024
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Abstract
Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure overlying a first substrate. A second substrate overlies the dielectric structure and comprises a movable element. A first bond structure is arranged between the dielectric structure and the second substrate. A second bond structure is arranged between the dielectric structure and the second substrate. At least a portion of the movable element is spaced laterally between sidewalls of the second bond structure. The first bond structure comprises a first material and the second bond structure comprises a second material different form the first material. A thickness of the first bond structure is less than a thickness of the second bond structure.
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