SENSOR DEVICE AND MANUFACTURING METHOD
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United States of America
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Issued Date -
Oct 31, 2024
app pub date -
Apr 15, 2022
filing date -
Apr 15, 2022
priority date (Note) -
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Abstract
A sensor device according to the present technology includes a semiconductor substrate that includes a plurality of photoelectric conversion elements arranged for each pixel and a pixel separation portion having a trench formed between pixels to separate the pixels. The pixel separation portion of the semiconductor substrate is formed in directions different from cleavage directions of crystals of the semiconductor substrate.
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