SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
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United States of America
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Issued Date -
Oct 31, 2024
app pub date -
Feb 27, 2024
filing date -
Feb 27, 2024
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Abstract
A solder reflow apparatus may include a vapor generating chamber configured to accommodate a heat transfer fluid, a heater configured to heat the heat transfer fluid, a vertical transfer portion, and at least one substrate stage. The vertical transfer portion may include a vertical conveyer supported by a driving pulley and a driven pulley so as to be rotatable in an endless track, the vertical conveyer having a conveying route of a descending path and an ascending path in the vapor generating chamber, and at least one substrate stage fixedly fastened to one side of the vertical conveyor by a fastening portion so as to be raised and lowered in the vapor generating chamber by rotation of the vertical conveyor. The at least one substrate stage may be configured to support a substrate on which an electronic component may be mounted via a solder.
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