MOLDED PACKAGE WITH INTERCONNECT POSTS WITH PLATED SOLDER CAPS
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United States of America
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Issued Date -
Oct 31, 2024
app pub date -
Apr 24, 2024
filing date -
Apr 24, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A molded package module has a substrate, and multiple interconnect members attached to a bottom side of the substrate. A mold surrounds and extends between the interconnect members. The interconnect members can be electrically and thermally conductive and include a first post portion adjacent the substrate and a second portion adjacent the first post portion so that the first post portion is interposed between the second portion and the substrate. The second portion includes a solderable material. The molded package module can be mounted via a solderable surface at a distal end of the second portion to a motherboard.
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