Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale Package
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Oct 31, 2024
app pub date -
Apr 28, 2023
filing date -
Apr 28, 2023
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A device including a substrate, a front-end module circuit situated over the substrate and configured to provide radio frequency communications, and a wafer-level chip-scale package circuit situated over the front-end module circuit and connected to the front-end module circuit and configured to provide passive components for radio frequency communications.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully