Semiconductor Devices With A Rare Earth Metal Oxide Layer

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United States of America

APP PUB NO 20240363421A1
SERIAL NO

18766104

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Abstract

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The present disclosure describes a semiconductor device with a rare earth metal oxide layer and a method for forming the same. The method includes forming fin structures on a substrate and forming superlattice structures on the fin structures, where each of the superlattice structures includes a first-type nanostructured layer and a second-type nanostructured layer. The method further includes forming an isolation layer between the superlattice structures, implanting a rare earth metal into a top portion of the isolation layer to form a rare earth metal oxide layer, and forming a polysilicon structure over the superlattice structures. The method further includes etching portions of the superlattice structures adjacent to the polysilicon structure to form a source/drain (S/D) opening and forming an S/D region in the S/D opening.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Szu-Hua Hsinchu City, TW 16 54
Hu, Kuan-Kan Hsinchu City, TW 20 0
LIN, Han-Yu Hsinchu City, TW 48 35
Lin, Pinyen Rochester, US 223 1197
Sano, Kenichi Hsinchu City, TW 45 259
Shih, Che Chi Hsinchu, TW 12 0
Wang, Po-Cheng Kaohsiung City, TW 9 103
Woon, Wei-Yen Hsinchu, TW 47 95

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